High speed die-cutting adaptation technology for foam adhesive products in the electronics industry

With the rapid iteration of consumer electronics, new energy electronics and precision digital accessories, the application scenarios of foam, double-sided adhesive, dust and shock adhesive and other products is expanding. Electronic foam adhesive products with soft material, thin thickness, strong adhesion, easy to stretch, deformation and other characteristics, and traditional paper packaging materials are very different. They have high adaptability requirements to high speed die-cutting equipment precision, pressure control, paper feeding stability, waste discharge system, etc. High-speed die-cutting is the core process of mass production of electronic adhesive products. The applicability of the process directly determines the product yield, production efficiency and precision dimension accuracy. Combining with industry experience, this paper describes the key technical points of high

1.speed die cutting adaptability of electronic foam adhesive products.
Characteristics of raw materials and difficulties in adapting to high speed die-cutting.
Foam adhesive products used in the electronics industry include PORON foam, EVA foam, silicone foam, PET double-sided adhesive tape, non-woven tape, etc. They are mostly multilayered composite structures with release paper on the surface and a soft, strong adhesive. Under the condition of high speed die-cutting, the material is prone to tensile deformation, blade adhesion, uneven cutting, edge burr and waste product pulling. At the same time, electronic components are mostly small and precise parts with dimensions tolerances of ± 0.1mm. In the process of high-speed continuous production, slight vibration, pressure deviation, paper feeding misalignment, etc., will cause batch defects. In addition, foam material is elastic and bounces easily during high-speed die-cutting, which leads to incomplete die-cutting and uneven half-cutting depth, which is the core difficulty of high-speed die-cutting adaptation.

2, Optimization technology of die cutting tool and pattern matching
According to the material characteristics of foam adhesive products, tool and die cutting methods are optimized to meet high speed production conditions. First of all, the die cutter with high hardness and high precision of mirror polishing should be preferred. Smooth cutting edge can effectively reduce the adhesion and avoid problems of adhesion and wire drawing during high-speed continuous stamping. Secondly, the blade angle is adjusted according to the product thickness. Thin double-sided tape uses sharp knives, while high-density foam uses reinforced blades to prevent tool breakage and curling during high-speed stamping. At the same time, we should arrange die-cutting layout scientifically, make use of reasonable product spacing and waste margins, avoid material tensile deformation during high-speed feed, and eliminate local pressure inhomogeneity and cutting anomaly caused by dense layout.

3, High speed die-cutting pressure and speed matching technology.
The precise match of pressure and speed is the key to guarantee the quality of die cutting of precision adhesive products. High pressure and hard cutting of electronic foam adhesive products are strictly prohibited. Adopt the The "light pressure precise cutting" mode, adjust the die cutting pressure according to the thickness and hardness of the material, ensure that the surface of the glue is completely cut off, the substrate slightly retained. This not only satisfies the molding requirement of the product, but also avoids the deformation of the embossing paper and the laminating material. In the aspect of speed adaptation, the principle of gradient speed adjustment should be followed. When testing new product, the parameters are calibrated at low speed, the speed of the equipment is gradually increased after stabilization, and the positioning bias and punching recoil caused by direct high speed start are eliminated. For highly elastic foam materials, the instantaneous punching speed should be reduced, the stress release time of material should be reserved, and the rebound rate and uneven cutting rate of the product should be significantly reduced.

4. Transformation and debugging technology of input positioning system.
The accuracy and stability of high-speed die cutting depend on the adaptability of feed and positioning systems. Foam adhesive products gentle texture and are easy to stretch. The pressure of the paper feeding wheel needs to be adjusted to a uniform, gentle state to avoid slippage and distortion caused by excessive or insufficient pressure. At the same time, calibrate the positioning accuracy of the front and side gauges gauges, eliminate transmission clearances, and ensure no deviation in each feed positioning. It is necessary to optimize the tension control of feed and unload, maintain the tension constant and prevent uneven material elasticity and tensile deformation when running at high speed. In addition, regular cleaning of adhesive impurities on the surface of the conveyor platform and feed wheel to avoid product indentation and size deviation due to foreign protrusion.
5. Optimization of Waste Disposal and Anti stick Adaptation Process
In high-speed mass production, the most common faults are adhesives, sticky waste and poor waste discharge. In order to reduce the residue adhesion problem caused by electrostatic adsorption of adhesive products, it is necessary to have a special anti-static device and a special sewage roller. At the same time, the die cutter can be anti-stick treatment, and regularly clean the residual glue on the blade, to avoid the accumulation of glue affect the cutting accuracy. For small precision products, using auxiliary scavenging die and segmented waste removal processes, the problems of product pulling, displacement and shedding during high-speed scavenging are eliminated, and the stability and yield of mass production are effectively improved.

6. Conclusion.
High-speed die-cutting of foam adhesive products in the electronics industry depends on a complete overhaul of equipment, tools, pressure, speed and waste disposal processes. Compared with traditional die-cutting process, precision electronic materials pay more attention to fine tuning of parameters and flexible adjustment of production adaptation. By optimizing tool, matching speed and pressure, stabilizing feeding positioning, improving waste product removal and anti-adhesion process, the problems of deformation, tool adhesion and accuracy deviation in high-speed production can be effectively solved, so as to ensure that product accuracy meets standards, improve production efficiency and meet the needs of the electronics industry for the mass production of precision accessories.